Intel and ASML report progress in High-NA EUV chipmaking

Intel ($INTC) and ASML ($ASML) said more than one million wafers have been processed using High-NA EUV equipment across testing, development and production. The technology is already used for selected layers in some Intel Core Ultra Series 3 processors manufactured on Intel 18A. The companies said throughput and precision requirements had been met. The million-wafer total includes development and testing, not just commercial output.

Sources:

• Intel — joint announcement with ASML